Probeless testing of pad buffers on wafer

ABSTRACT

The peripheral circuitry ( 350, 360 , ESD, BH) of an integrated circuit die on a wafer is tested without physically contacting the bond pads of the die.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of application Ser. No. 13/891,885,filed May 10, 2013, currently pending;

Which was a divisional of application Ser. No. 13/591,347, filed Aug.22, 2012, now U.S. Pat. No. 8,464,109, issued Jun. 11, 2013;

Which was a divisional of application Ser. No. 13/352,484, filed Jan.18, 2012, now U.S. Pat. No. 8,281,194, issued Oct. 2, 2012;

Which was a divisional of application Ser. No. 13/042,875, filed Mar. 8,2011, now U.S. Pat. No. 8,122,310, issued Feb. 21, 2012;

Which was a divisional of application Ser. No. 12/495,924, filed Jul. 1,2009, now U.S. Pat. No. 7,925,951, issued Apr. 12, 2011;

Which was a divisional of application Ser. No. 12/182,305, filed Jul.30, 2008, now U.S. Pat. No. 7,574,641, issued Aug. 11, 2009;

Which was a divisional of application Ser. No. 11/759,560, filed Jun. 7,2007, now U.S. Pat. No. 7,451,370, issued Nov. 11, 2008;

Which was a divisional of application Ser. No. 10/806,539, filed Mar.23, 2004, now U.S. Pat. No. 7,257,749, issued Aug. 14, 2007;

Which was a divisional of application Ser. No. 09/745,523, filed Dec.21, 2000, now U.S. Pat. No. 6,731,106, issued May 4, 2004;

Which was a divisional of application Ser. No. 09/049,626, filed Mar.27, 1998, now U.S. Pat. No. 6,199,182, issued Mar. 6, 2001;

Which claimed priority from Provisional Application No. 60/041,729,filed Mar. 27, 1997.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

BACKGROUND OF THE DISCLOSURE

The present Disclosure relates generally to testing an integratedcircuit die on a wafer without physically probing its bond pads and,more particularly, to testing the pad buffers, electrostatic dischargeprotection circuitry, and pad bus holders of the die without physicallyprobing the bond pads.

Scan testing of circuits is well known. Scan testing configures thecircuit into scan cells and combinational logic. Once so configured, thescan cells are controlled to capture test response data from thecombinational logic, then shifted to unload the captured test responsedata from the combinational logic and to load the next test stimulusdata to apply to the combinational logic.

FIG. 1 shows an electrical circuit having three memories (M) A,B,C andcombinational logic (CL). FIG. 2 shows an example of the memories ofFIG. 1 implemented as D flip flops (FF), each memory having a datainput, data output, and clock and reset control signals. FIG. 3 showsone example of how the circuit of FIG. 1 can be made scan testable byconverting the memories into scan cells and connecting the outputs(D,E,F) of the combinational logic to the scan cell capture inputs. FIG.4A shows an example of how a D flip flop based memory is converted intoa scan cell. The scan cells have a 3:1 multiplexer input to the flipflop. The multiplexer receives selection control (S) to: (1) input theoutput of the combinational logic to the flip flop (Input1, the captureinput), (2) input the external input to the flip flop (Input2, thefunctional input), or (3) input the serial input to the flip flop (SI,the shift input). The flip flop receives a clock (C) and a reset (R)control input. The scan cells are connected together via their serialinput (SI) and serial output (SO) to form a 3-bit scan path through thecircuit of FIG. 3. The three scan cells operate as the state memoriesduring functional operation. During test operation, the scan cellsoperate as scan cells to allow inputting test stimulus to thecombinational logic and capturing the response output from thecombinational logic. While edge sensitive D flip flop memories are usedin this disclosure, level sensitive memories could be used as well.Converting level sensitive memories into scan memories is well known.

In the FIG. 3 example, the scan cells perform both the input of stimulusto the combinational logic and the capture of response from thecombinational logic. In other examples of how the circuit may be madescan testable, scan cells could be added to the circuit and scan path,and coupled to the outputs of the combinational logic, as shown in thedotted boxes in FIG. 3. This would allow the input stimulus to besupplied by the converted scan cells (A,B,C) and the output responsecaptured by the added scan cells. Adding scan cells for the purpose ofcapturing response data adds circuitry. Also if scan cells are added tocapture the combinational logic response, the converted scan cells A,B,Cdo not need Input1 and the feedback connections from the combinationallogic outputs.

Also in FIG. 3 a bypass memory (BM) is shown to allow a single bitbypass scan path through the circuit from SI to SO. The use of scanbypass memories is well known. An example of the bypass memory is shownin FIG. 4B. In addition to providing conventional bypassing of thecircuit, the bypass memory of the present Disclosure is required tomaintain its present state during capture operations, and to always loaddata from SI regardless of whether it is selected between SI and SO ornot. The multiplexer of the bypass memory and the selection (S) controlit receives allow these two requirements to be met.

FIG. 5 shows three of the circuits of FIG. 3 connected in series to atester. The tester outputs data to the serial input of the first circuit(C1) and receives data from the serial output of the last circuit (C3).The tester outputs control to all three circuits to regulate their scancell's capture and shift operations during each scan test cycle.

FIG. 6 shows the concept of conventional scan testing. In FIG. 6, Ncircuits are connected on a scan path. A tester controls all circuitsC1-N to reset. Following reset, the tester controls all circuits C1-N tocapture the first response data to the reset stimulus data. Next thetester controls all circuits C1-N to shift out the first capturedresponse data and shift in the second stimulus data. This process ofcapturing response data, shifting out the response data while newstimulus data is shifted in is repeated for the number of patterns (P)required to test each of the circuits 1-N. As the number of seriallyconnected circuits (N) grows, so does the length (L) of the scan paththe tester needs to traverse during each capture/shift cycle. The testtime in clocks, using conventional scan testing, is equal to the sum ofthe scan path lengths (L) of each circuit (N) in the scan path times thenumber of patterns (P) to be applied.

Example 1 shows how three circuits (C1, C2, and C3) are conventionallyscan tested by a tester as shown in FIG. 5. The combinational logicdecode for each of the circuits C1, C2, and C3 are shown in the Tablesof Example 1. The tables show the present state (PS) output (i.e.stimulus) of the scan cells (ABC) to the combinational logic and thenext state (NS) input (i.e. response) to the scan cells (ABC) from thecombinational logic. At the beginning of the test, the tester outputscontrol to reset all scan cells to a first present state (PS1). Next,the tester outputs control to all scan cells to do a first capture (CP1)of the response output of the combinational logic (CL) to the PS1stimulus. Next, the tester outputs control to do a first 9-bit shiftoperation (SH1) to unload the first captured response data from eachcircuit's scan cells and to load the second present state (PS2) stimulusdata to each circuit's scan cells. Next, the tester does a secondcapture (CP2) to load the scan cells with the response data from thesecond present state (PS2) stimulus data, then does a second 9-bit shift(SH2) to unload the second captured response data and load the thirdstimulus data. Next, the tester does a third capture (CP3) to load thescan cells with the response data from the third present state (PS3)stimulus data, then does a third 9-bit shift (SH3) to unload the thirdcaptured response data and load the fourth stimulus data (11). Thisprocess continues through an eighth capture (CP8) to load the scan cellswith the response data from the eighth present state (PS8) stimulusdata, then does an eighth 9-bit shift (SH8) to unload the final capturedresponse data. The data input to the scan cells during the eighth shift(SH8) can be don't care data (x) since testing is complete following theeighth shift. If all circuits are good the response shifted out for eachPS1-8 stimulus will match the expected response as shown in the tablesfor C1, C2, and C3. The number of test clocks for the conventional scantesting of the circuits in example 1 is the sum of the capture clocks(CP1-8) and shift clocks (SH1-8), or 8+(8×9)=80.

It is desirable to scan test electrical circuits in less time than theconventional approach.

The present Disclosure accelerates scan testing by re-using onecircuit's scan test response data as scan test stimulus data for anothercircuit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a known electrical circuit having threememories.

FIG. 2 is a block diagram of one memory part of FIG. 1.

FIG. 3 is a block diagram of a circuit having a 3-bit scan path.

FIGS. 4A and 4B are block diagrams of a bypass memory of FIG. 3.

FIG. 5 is a block diagram of three circuits of FIG. 3 connected inseries to a tester.

FIG. 6 is a block diagram of N circuits connected on a scan path in aknown manner.

FIG. 7 is a block diagram of N circuits connected on a scan pathaccording to the disclosed invention.

FIG. 8 is a block diagram of N circuits connected on a scan path anddepicting N progressive scan test patterns.

FIG. 9 is a block diagram of a circuit similar to that in FIG. 3 withonly a 2-bit scan path.

FIG. 10 is a block diagram of a circuit similar to that in FIG. 3 with agreater number of outputs than inputs.

FIG. 11 is a block diagram of a scan cell C of FIG. 10.

FIG. 12 is a block diagram of the circuit of FIG. 10 modified to acceptthe warping scan test concept.

FIG. 13 is a block diagram of a summing cell (DSC).

FIG. 14 is a block diagram of a scan testable circuit.

FIG. 15 is a block diagram of a data retaining cell (DRC).

FIG. 16 is a block diagram of an implementation of a warping scan testconcept.

FIG. 17 is a block diagram of another implementation of a warping scantest concept.

FIG. 18 is a block diagram of another implementation of a warping scantest concept.

FIG. 19 is a block diagram of a data capture boundary cell (DCBC).

FIG. 20 is a block diagram of a data retaining boundary cell (DRBC).

FIG. 21 is a block diagram of a data summing boundary cell (DSBC).

FIG. 21A is a block diagram of a realization of DCBC, DRBC, and DSBC.

FIG. 22 is a block diagram of circuits C1-CN being tested inside an ICor die.

FIG. 23 is a block diagram of ICs 1-N being tested on a circuit board.

FIG. 24 is a block diagram of boards BD being tested in a box.

FIG. 25 is a block diagram of multiple boxes 1-N being tested in asystem.

FIG. 26 is a representation of dies being tested on a wafer.

FIG. 27 is a block diagram of a test access port on a die.

FIG. 28 is a representation of wafers, each carrying dies, being testedin a lot.

FIG. 29 is a representation of wafer lots 1-N beings tested.

FIG. 30 is a block diagram of a circuit and scan path with conventionalsignature analyzers.

FIG. 31 is a representation of a wafer with additional bussing and testpads.

FIG. 32 is a block diagram of a test access port on a die.

FIG. 33 is a block diagram of a conventional IEEE STD 1149.1 scan cell.

FIG. 34 is a block diagram of a circuit using four conventional scancells S.

FIG. 35 is a block diagram of a circuit similar to that of FIG. 34.

FIG. 36 is a block diagram of a circuit relating to an input buffer.

FIG. 37 is a block diagram of a circuit relating to a bi-directionalpad.

FIG. 38 is a block diagram of the circuits of FIGS. 34-37 bussedtogether on a die.

FIG. 39A is a block diagram of a 3-state output buffer.

FIG. 39B is a block diagram of a known ESD circuit.

FIG. 39C is a block diagram of another known ESD circuit.

FIG. 40A is a block diagram of a tester and an input buffer.

FIG. 40B is a block diagram of a known ESD circuit.

FIG. 41 is a block diagram of a tester and an analog output buffer.

FIG. 42 is a block diagram of a tester and an analog input buffer.

DETAILED DESCRIPTION OF THE DRAWINGS

FIG. 7 shows the warping scan test concept of the present Disclosure.The term warping is used to indicate the non-conventional way serialdata propagates through circuits during scan testing according to thepresent Disclosure. In FIG. 7, N circuits are connected on a scan path.A tester controls all circuits C1-N to reset. Following reset, thetester controls all circuits C1-N to capture the first response data tothe reset stimulus data. Next the tester controls all circuits C1-N toshift data, but only for the length of the first circuit's (C1) scanpath. After the first shift operation, C1's scan path is loaded withstimulus data from the tester and C2-CN's scan path is loaded with theresponse data from C1-CN−1. During the next capture and shift operation,C1 outputs response data to downstream circuits and receives its nextstimulus data from the tester. After the second capture and shiftoperation, C1 contains its second stimulus data pattern from the testerand C2-CN contain their second stimulus patterns derived from theresponse output from leading circuits C1-CN−1. This process continuesuntil C1 is tested. After C1 is tested, it is bypassed so that thetester can directly input any remaining stimulus to C2 and allowresponse from C2 to ripple downstream as stimulus to trailing circuitsC3-CN. Similarly, after C2 is tested, it is bypassed to allow directinput of remaining stimulus to C3 while response from C3 is rippleddownstream as stimulus to trailing circuits C4-CN. The overall testingof circuits C1-CN in FIG. 7 is complete when all circuits have receivedtheir required input stimulus, either indirectly as a result of outputresponse from leading circuits or by direct input from the tester, andhave output their response to the tester.

FIG. 8 shows a conceptual flow of the above described warping scan testoperation as it progresses across circuits C1-CN. The test sessions ofFIG. 8 indicate times when a tester is inputting stimulus to a givencircuit scan path, either directly to C1 or through tested and bypassedcircuits (C1-CN−1). The shaded area in each circuit C1-CN indicatesreduction of remaining stimulus input to a circuit following a giventest session. When a circuit is completely tested, it is shown to bebypassed and completely shaded. The progression of the shaded areas ofeach circuit indicate the test acceleration anticipated by the presentDisclosure. For example, following test session 1 (C1 tested), theresponse generated to downstream circuits C2-CN during test session 1has reduced their need for additional stimulus patterns from the testerby 50%. Following test session 2 (C2 tested), the response generated todownstream circuits C3-CN during test session 2 has reduced their needfor additional stimulus patterns from the tester by another 50%. And soon. The present Disclosure will show that scan test time can bedramatically reduced by using output response from leading circuits asstimulus input to trailing circuits which can reduce or even eliminatethe need of stimulus input from the tester.

Example 2 shows how the same three circuits (C1,C2,C3) of Example 1would be tested using the warping scan test concept whereby responsedata from leading circuits is used as stimulus data in trailingcircuits. At the beginning of the test, the tester outputs control toreset or initialize all scan cells to a first present state 1 (PS1).Note that while a reset input is provided on the scan cells to allow thetester to initialize the scan paths by a reset control signal (as seenin FIG. 4A), the tester could also initialize non-resetable scan cellsby doing a scan operation. Next, the tester outputs control to all scancells to do a first capture (CP1) of the response output of thecombinational logic (CL) to the first present state (PS1) stimulus. Thetester then outputs control to cause all scan cells of circuits C1through C3 to do a first 3-bit shift operation (SH1). The first 3-bitshift operation unloads the first captured 3-bit response data from C3,moves the first captured 3-bit response data from C1 to C2 and from C2to C3, and loads the second 3-bit stimulus data into C1.

Next, the tester outputs control to all scan cells to do a secondcapture (CP2) of the response output of the combinational logic (CL) tothe PS2 stimulus. The tester then outputs control to cause all scancells of circuits C1 through C3 to do a second 3-bit shift operation(SH2). The second 3-bit shift operation unloads the second captured3-bit response data from C3, moves the second captured 3-bit responsedata from C1 to C2 and from C2 to C3, and loads the third 3-bit stimulusdata into C1.

Next, the tester outputs control to all scan cells to do a third capture(CP3) of the response output of the combinational logic (CL) to the PS3stimulus. The tester then outputs control to cause all scan cells ofcircuits C1 through C3 to do a third 3-bit shift operation (SH3). Thethird 3-bit shift operation unloads the third captured 3-bit responsedata from C3, moves the third captured 3-bit response data from C1 to C2and from C2 to C3, and loads the fourth 3-bit stimulus data into C1.

This capture and shift process repeats until the seventh shift operation(SH7). During SH7, the tester unloads the seventh captured 3-bitresponse from C3, moves the seventh captured 3-bit response data from C1to C2 and from C2 to C3, and loads the eighth, and last, 3-bit stimulusdata into C1.

Next, the tester outputs control to all scan cells to do an eighthcapture (CP8) of the response output of the combinational logic (CL) tothe PS8 stimulus. The tester then outputs control to cause all scancells of circuits C1 through C3 to do an eighth 3-bit shift operation(SH8). The eighth 3-bit shift operation unloads the eighth captured3-bit response data from C3, moves the eighth captured 3-bit responsedata from C1 to C2 and from C2 to C3, and inputs the first bit of thefirst 3-bit C2 stimulus pattern into C1's bypass memory (BM). Note thatthe serial input during SH8 is 1xx because the leading two bits (xx)will not be used, while the last bit (1) will be stored in C1's bypassmemory and be the first bit of the first 3-bit stimulus pattern input toC2 during SH9. As previously mentioned in regard to FIG. 3, the bypassmemory always loads the data from SI during shift operations andmaintains its data during capture operations. This allows the presentDisclosure to use bypass memories as data pipeline bits between thetester and circuit receiving stimulus input from the tester.

Following SH8, C1 is completely tested and the tester outputs control tocause C1's bypass memory to be selected between C1's SI and SO. Also thetester outputs control to cause C1's scan cells to hold (H) theirpresent state for the remainder of the test. At this point, C1 onlyserves as a data pipeline bit between the tester and the scan path ofC2. While C1's scan cells could continue to operate during the remainingtests, doing so would cause C1 to consume non-useful energy and produceheat. The advantage of holding a circuits scan path static to eliminateheat build up after the circuit has been tested will be discussed inmore detail in regard to using the present Disclosure to acceleratewafer testing (FIGS. 26-29).

Next, the tester outputs control to all scan cells to do a ninth capture(CP9) of the response output of the combinational logic (CL) to the PS9stimulus. The tester then outputs control to cause all scan cells ofcircuits C2 and C3 (C1 scan cells are disabled) to do a ninth 3-bitshift operation (SH9). The ninth 3-bit shift operation unloads the ninthcaptured 3-bit response data from C3, moves the ninth captured 3-bitresponse data from C2 to C3, and loads C2 with its first 3-bit stimuluspattern (001) from the tester (00) and C1 bypass bit (1). The loading ofthe 001 stimulus pattern into C2 during SH9 is seen in the dotted circlearound the 00 tester input bits and dotted circle around the 1 bit inthe C1 bypass memory. The last bit (0) of the 3-bit tester input (000)during SH9 is stored into C1's bypass memory and will be the first bitof the second 3-bit stimulus pattern (100) to C2 during SH10. The 001stimulus to C2 during SH9 is a stimulus input pattern that is needed fortesting C2 but did not occur in C1's output response during SH1-8. Theother stimulus patterns that are needed for testing C2 but did not occurin the C1 response patterns are 100 and 111. These stimulus inputpatterns will be provided to C2 during the following SH10 (100) and SH11(111) operations.

Next, the tester outputs control to all scan cells to do a tenth capture(CP10) of the response output of the combinational logic (CL) to thePS10 stimulus. The tester then outputs control to cause all scan cellsof circuits C2 and C3 to do a tenth 3-bit shift operation (SH10). Thetenth 3-bit shift operation unloads the tenth captured 3-bit responsedata from C3, moves the tenth captured 3-bit response data from C2 toC3, and loads C2 with its second 3-bit stimulus pattern (100) from thetester (10) and C1 bypass bit (0). Again, the loading of the 100stimulus pattern into C2 during SH10 is seen in the dotted circle aroundthe 10 tester input bits and dotted circle around the 0 bit in the C1bypass memory. The last bit (1) of the 3-bit tester input (110) duringSH10 is stored into C1's bypass memory and will be the first bit of thethird 3-bit stimulus pattern (111) to C2 during SH11.

Next, the tester outputs control to all scan cells to do an eleventhcapture (CP11) of the response output of the combinational logic (CL) tothe PS11 stimulus. The tester then outputs control to cause all scancells of circuits C2 and C3 to do an eleventh 3-bit shift operation(SH11). The eleventh 3-bit shift operation unloads the eleventh captured3-bit response data from C3 and moves the eleventh captured 3-bitresponse data from C2 to C3. Again, the loading of the 111 stimuluspattern into C2 during SH11 is seen in the dotted circle around the 11tester input bits and dotted circle around the 1 bit in the C1 bypassmemory. The last bit (x) of the 3-bit tester input (x11) during SH11 isstored into C1's bypass memory but will not be used for testing becauseC2's scan path, into which it will be shifted during SH12, will bebypassed following the SH12 operation.

Next, the tester outputs control to all scan cells to do a twelfthcapture (CP12) of the response output of the combinational logic (CL) tothe PS12 stimulus. The tester then outputs control to cause all scancells of circuits C2 and C3 to do a twelfth 3-bit shift operation(SH12). The twelfth 3-bit shift operation unloads the twelfth captured3-bit response data from C3 and moves the twelfth captured 3-bitresponse data from C2 to C3. Again, the loading of the 0xx stimuluspattern into C2's scan path during SH12 is indicated by the dottedcircle around the 0x tester input bits and dotted circle around the xbit in the C1 bypass memory. As mentioned in the above paragraph thedata (0xx) loaded into C2 scan path is not used because the scan pathwill be bypassed following SH12. However, the last two bits of the SH12tester's 3-bit input (10x), will be loaded into the bypass memories ofC1 (1) and C2 (0), and used as the first two bits of the last remaining3-bit stimulus pattern input (010) for C3 during SH13.

Following SH12, C2 is completely tested and the tester outputs controlto cause C2's bypass memory to be selected between C2's SI and SO. Alsothe tester outputs control to cause C2's scan cells to hold (H) theirpresent state for the remainder of the test. At this point, C2 onlyserves as a data pipeline bit between the bypass bit of C1 and scan pathof C3.

Next, the tester outputs control to all scan cells to do a thirteenthcapture (CP13) of the response output of the combinational logic (CL) tothe PS13 stimulus. The tester then outputs control to cause all scancells of C3 to do a thirteenth 3-bit shift operation (SH13). Thethirteenth 3-bit shift operation unloads the thirteenth captured 3-bitresponse data from C3 and moves the last remaining 3-bit stimulus input(010) from the tester and C1 and C2 bypass bits into C3's scan path.Again, the loading of the 010 stimulus pattern into C3's scan pathduring SH13 is seen by the dotted circle around the tester's 0 input bitand dotted circles around the 1 and 0 bits in the C1 and C2 bypassmemories. Since this is the last required stimulus pattern from thetester, the tester inputs x bits following the 0 bit input during SH13.

Next, the tester outputs control to all scan cells to do a fourteenthcapture (CP14) of the response output of the combinational logic (CL) tothe PS14 stimulus. The tester then outputs control to cause all scancells of C3 to do a fourteenth 3-bit shift operation (SH14) to unloadthe last response output from C3. Following SH14, the test of C3 iscomplete.

The number of test clocks required to test circuits C1, C2, and C3 usingthe warping scan test concept is the sum of the capture clocks (CP1-14)and the shift clocks (SH1-14), or 14+(14×3)=56 clocks. This compareswith 80 clocks used to test the same circuits using the conventionalscan test approach in example 1.

During the testing of C1, C2 was provided with its 000, 010, 011, 110,and 101 stimulus inputs from C1 response, i.e. C2 received 5 of its 8stimulus inputs while C1 was being tested. Also during testing of C1, C3was provided with its 000, 001, 011, 100, 111, and 110 stimulus inputsfrom C2 response, i.e. C3 received 6 of its 8 stimulus inputs while C1was being tested. Note that C3's 001 stimulus input at PS2 was generatedby C2 as a response to C2's initial 000 (reset) stimulus input at PS1,so C3's 001 stimulus was generated independently of any stimulus scannedin from the tester. Similarly, C3's 011 stimulus at PS3 originated asC1's response to its 000 (reset) stimulus at PS1, so C3's 011 stimuluswas also independent of any stimulus scanned in from the tester. AfterC1 was bypassed, C2 received its remaining 001, 100, and 111 stimulusinputs from the tester. During the testing of C2, C3 was provided withits 101 stimulus input from C2 response, i.e. C3 received 1 of its 2remaining stimulus inputs while C2 was being tested. After C2 wasbypassed, C3 received its remaining 010 stimulus input. From this it isseen that C2 was 62.5% tested (5 of 8) and C3 was 75% tested (6 of 8)after C1 was tested. Also, it is seen that C3 was 87.5% tested (7 of 8)after C2 was tested.

Although the tester obviously does not receive all response bits fromall circuits, it does receive a bit stream that is (1) uniquelypredictable based on the circuits under test and the scan pathstructure, and (2) representative of all responses from all of thecircuits under test. Similarly the tester does not provide all stimulusbits to all circuits, but the stimulus needed from the tester is readilydetermined based on the circuits under test and the scan path structure.

A diagram showing the contents of the scan path at key times during thetest, for example the diagram shown in Example 2, is readily generatedas follows. First, all the bit data from PS1 through CP8 is generated bystarting with all scanned cells cleared to 0 at PS1, and then filling inthe remaining bits based on the C1, C2 and C3 tables and the sevenstimulus patterns which must be shifted in at SH1-SH7 to complete thetesting of C1. The final response pattern from C1 is captured at CP8.

It is next determined which C2 stimulus patterns still need to beshifted in from the tester to complete the testing of C2. This is doneby simply inspecting the bit patterns at PS1-PS8 of the C2 column and atCP8 of the C1 column, and then comparing the inspected bit patterns tothe known required set of C2 stimulus patterns. Any C2 stimulus patternsmissing from the inspected patterns must be shifted in to C2 from thetester. Next, all bit data from SH8 through CP12 is filled in based on(1) the C2 and C3 tables, (2) the remaining C2 stimulus patterns to beshifted in from the tester, and (3) the fact that the remaining C2stimulus patterns will be shifted from the tester to C2 via the C1bypass bit. The final response pattern from C2 is captured at CP12.

It is next determined which C3 stimulus patterns still need to beshifted in from the tester to complete the testing of C3. This is doneby simply inspecting the bit patterns at PS1-PS12 of the C3 column andat CP12 of the C2 column, and then comparing the inspected bit patternsto the known required set of C3 stimulus patterns. Any C3 stimuluspatterns missing from the inspected bit patterns must be shifted in toC3 from the tester. Next, all bit data from SH12 through CP14 is filledin based on (1) the C3 table, (2) the remaining C3 stimulus pattern, and(3) the fact that the remaining C3 stimulus pattern will be shifted fromthe tester to C3 via the C1 and C2 bypass bits. The final responsepattern from C3 is captured at CP14.

Once the scan path contents diagram has been completed using theabove-described procedure, both the stimulus bit stream required to beoutput from the tester and the response bit stream expected to bereceived at the tester are easily determined by inspection of thecompleted diagram. In particular, the stimulus bit stream required fromthe tester is shown in the SI column of the completed diagram, and theresponse bit stream expected to be received at the tester is shown inthe SO column of the completed diagram.

The scan path contents diagram for any desired set of circuits undertest can actually be completed manually using pencil and paper andfollowing the above-described procedure. Of course, a computer programcan be readily written to complete the diagram in automated fashion.

In Example 2, the response from C1 reduced the need of stimulus in C2and C3. Also, the bypass concept works to allow circuits downstream ofcircuits already tested to receive stimulus data from the tester througha pipelined data path that maintains the stimulus data from the testerduring capture operations. While the Disclosure can work by shiftingdata through the scan paths of circuits previously tested, instead ofusing the bypass memory, the scan path length between the tester anddownstream circuits being tested grows in length since following eachcapture operation, the tester must shift data through all leading testedcircuits to input data to circuits being tested. Further, the use of thebypass feature allows the scan paths of circuits tested to be heldstatic while testing is progressing in downstream circuits. Holding scanpaths static eliminates power consumption within tested circuits, exceptfor the bypass scan path, and thereby eliminates heat build up incircuits previously tested. Eliminating heat build up in circuits isimportant, especially at wafer level testing using the warping scan testconcept as will be described in regard to FIGS. 26-29.

A Further advantage to the bypassing feature is that it allows thetester to directly, via intermediate bypass memories, apply allremaining stimulus patterns to the circuit being tested downstream. Ifthe scan paths of previously tested circuits were to remain in the scanpath between the tester and circuit being tested, there is thepossibility that the circuit being tested may not be able to receive allof its remaining stimulus patterns. This is because the scan pathsbetween the tester and circuit being tested may not be able to producethe required stimulus patterns by the capture and shift process. Simplyput, the intermediate scan paths between the tester and circuit beingtested may not have a response pattern to any stimulus pattern appliedthat will produce the required remaining stimulus pattern(s) for thecircuit being tested.

FIG. 9 shows a circuit similar to the FIG. 3 circuit except that it onlyhas a 2-bit scan path. The circuit of FIG. 9 will be used in Examples 3and 4 to illustrate the operation of the present Disclosure withcircuits having unequal scan path lengths.

Example 3 illustrates three circuits C1, C2, and C3, again connected toa tester as shown in FIG. 5. C1 has a 2-bit scan path, C2 has a 3-bitscan path, and C3 has a 2-bit scan path. The tables for C1, C2, and C3show the stimulus and response reaction of each circuit's combinationallogic during scan testing. At the beginning of the test, the testeroutputs control to reset all circuit scan paths to a first initialpresent state as previously described in Example 2. Then the tester doesfour capture and 2-bit shift operations (CP1-4 & SH1-4) to test C1 aspreviously described in Example 2. At the end of SH4, C2 has been testedagainst 4 of its 8 3-bit stimulus patterns (000,010,100,111), and C3 hasbeen tested against 3 of its 4 2-bit stimulus patterns (00,01,11).

After the fourth shift operation (SH4), C1 is completely tested and isbypassed as previously described in Example 2. Also after SH4, thetester adjusts from 2-bit shift operations to 3-bit shift operations totest C2 since it has a 3-bit scan path. To complete the testing of C2,the tester does four capture and 3-bit shift operations (CP5-8 & SH5-8).CP5 and SH5 test C2 and C3 against previously tested 000 and 00 stimuluspattern, respectively, left in C2's and C3's scan path at the end ofSH4. SH5 also loads into C2's 3-bit scan path the first of the remainingfour C2 stimulus patterns (001), whose response is captured at CP6.CP7-9 and SH6-9 test C2 against the remaining three C2 stimulus patterns(011,101,110). During CP8 and SH8, C3 is tested against its remaining2-bit stimulus pattern (10) by output response from C2 during CP7 andSH7, so C3 is completely tested by the testing of C1 and C2. CP9 loadsthe last response from C2 to its last remaining stimulus pattern (110).Since C3 has been tested, the tester does not need to bypass C2.Subsequently, during SH9, the tester adjusts the scan operation to alength of 5 bits so that the final response from C2 can be shifted outduring the SH9 operation. It is important to note here that the 2-bitcontents of C3's scan path is important during the SH9 operation, sinceit contains the response residue of C2 to the 101 stimulus patterncaptured and shifted out of C2 during the CP8 and SH8 operations.

During the first four capture and 2-bit shift operations, the 3-bit scanpath of C2 is only partially filled from C1 (2-bits) and only partiallyemptied to C3 (2-bits). This means that one bit of C2's 3-bit responsepattern from a previous capture and shift operation will remain in C2'sscan path and be reused itself as part of the stimulus pattern for thenext capture and shift operation of C2. The other two bits used for C2'snext 3-bit stimulus pattern will be provided by the shifted in 2-bitresponse output from C1.

In general, a leading circuit with a shorter scan path will amplify thenumber of stimulus patterns input to a following circuit with a longerscan path. This is because the frequency of capture and shift operationsto both circuits is determined by the time it takes to shift data in andout of the leading shorter scan path. For example, at the beginning ofthe Example 3 test, the frequency of the capture and shift operations toall circuits is set by the first four (SH1-4) 2-bit shift operationsthat load stimulus patterns from the tester into C1. This same captureand shift frequency for the first four 2-bit shift operations is used toload stimulus patterns from C1 into C2, and from C2 into C3. So, C2actually receives its first four stimulus patterns, which would takefour 3-bit shift operations using conventional scan testing, in onlyfour 2-bit shift operations using the warping scan test concept. For thefirst four shift operations, the input stimulus pattern to C2 comprisestwo bits of response from C1 plus one bit of retained response from C2.This is seen for example in the creation of C2's third present state(PS3) stimulus pattern 100. PS3 100 is created by CP2 loading the scanpaths of C1 and C2 with 10 and 011, respectively, then shifting the scanpaths twice during SH2 to obtain 100 in C2's scan path.

The number of test clocks required to test circuits C1, C2, and C3 usingthe warping scan test concept shown in Example 3 is 34. Testing thecircuits of Example 3 using conventional scan testing, as described inExample 1, would require 64 test clocks.

Example 4 illustrates three circuits C1, C2, and C3, again connected toa tester as shown in FIG. 5. C1 has a 3-bit scan path, and C2 and C3both have 2-bit scan paths. The tables for C1, C2, and C3 show thestimulus and response reaction of each circuit's combinational logicduring scan testing. At the beginning of the test, the tester outputscontrol to reset all circuit scan paths to a first initial present stateas previously described in Example 2. Then the tester does seven captureand 3-bit shift operations (CP1-7 & SH1-78) and one capture and 7-bitshift operation (CP8 & SH8) to test C1 as previously described inExample 2. During the testing of C1, C2 and C3 receive all theirrequired stimulus patterns by response output from C1. So when C1 istested, so are C2 and C3. Since C2 and C3 are tested during C1's tests,no bypassing steps are required. Following CP8, a seven bit shiftoperation is performed during SH8 to allow the tester to unload allresponse residue from the scan paths of C1, C2, and C3 to complete thetest.

The number of test clocks required to test circuits C1, C2, and C3 usingthe warping scan test concept shown in Example 4 is 36, as opposed to 64test clocks using conventional scan testing as described in Example 1.

FIG. 10 shows a circuit similar to the previously described FIG. 3circuit, except that it has an greater number of outputs (3) than inputs(2). Since the number of outputs is greater than the number of inputs, ascan cell is added to the extra output so that its response can becaptured and shifted out during scan testing. The structure of the scancell (C) added and connected to the F output of the combinational logicis prior art and shown in FIG. 11. During conventional scan testing,scan cell C serves to capture the F output and shift the data out. It isimportant to note that in conventional scan testing of the FIG. 10circuit, the data shifted into the scan cell (C) is don't care datasince the data does not provide stimulus input to the combinationallogic.

FIG. 12 shows how the FIG. 10 circuit is modified to support the warpingscan test concept. The modification is to replace the prior art scancell (C) connected to F with a data summing cell (DSC) as shown in FIG.13. The warping scan test concept requires that scan cells that areadded solely for the purpose of capturing response data, as shown inscan cell C of FIG. 12, be loaded during capture operations with the sumof their present state data and the data they are capturing. This way,response data shifted into the scan cell is not lost during the captureoperation.

In FIG. 13, the data summing cell includes a 3 input multiplexer, an XORgate, and a FF. The multiplexer is controlled by a select signal (S) toallow either the output of the XOR, the normal capture input (Input), orthe serial input (SI) to be coupled to the FF. During conventional scantesting, the multiplexer couples the Input to the FF during captureoperations, and the SI to the FF during shift operations, just like theFIG. 11 scan cell. During warping scan tests, the multiplexer couplesthe XOR output to the FF during capture, instead of the conventionalInput. The output of the XOR represents the sum of the Input data andthe present state data of the FF. The reason for summing the Input datawith the FF's present state data is that the FF will potentially containresponse data shifted in from a previous circuit, which is not used inFIG. 12 as stimulus. The response data bit in the FF cannot be lost bythe capture operation, as is done in the conventional scan cell of FIG.11. If the response data were lost (overwritten) by the captureoperation, that response data bit or its effect as stimulus todownstream circuits would not be seen by the tester. So, to allow theresponse data in the FF to be maintained during the capture operation,it is summed with the Input data, and that sum data is stored into theFF during capture. Since the FF data is not lost, it meets therequirement mentioned above for the warping scan test concept.

Example 5 shows two circuits C1 and C2 being tested using the warpingscan test concept. C1 is a circuit as shown in FIG. 3 with a 3-bit scanpath. C2 is a circuit as shown in FIG. 12 with a data summing cell (DSC)coupled to the F output of the combinational logic. The present stateand next state table of C1 is shown as previously described. The presentstate and next state table for C2 indicates the summing of the F outputof the combinational logic and the present state of scan cell C (theDSC). In looking at FIG. 12 it is seen that the combinational logic onlyresponds to stimulus from scan cells A and B. In looking at the C2table, it is seen that; (1) for a PS ABC of 00x, the DEF outputs are010, (2) for a PS ABC of 01x, the DEF outputs are 100, (3) for a PS ABCof 10x, the DEF outputs are 110, and (4) for a PS ABC of 11x, the DEFoutputs are 000. Again looking at the C2 table it is seen that; when F=0and the PS C=0, the NS C=0, and when F=0 and the PS C=1, the NS C=1.This shows the XOR'ing of output F with PS data in scan cell C.

The warping scan test of C1 and C2 in Example 5 proceeds as previouslydescribed. What is important about Example 5 is to see the that theresponse data from C1 shifted into scan cell C of C2 is not lost duringthe capture operations. During each capture operation the response datafrom C1 in scan cell C is summed with the response output F from C2'scombinational logic and that summed signal is shifted out to the testerfor inspection. This way if C1 or C2 had a faulty response bit, it wouldbe detectable by the tester. It is possible for a double fault to occurin C1 and in C2 such that the sum of the two faults appear to be acorrect response. For example if a good response of 1 from C1 weresummed with a good response of 0 from C2, the result would be an outputto the tester of a 1. If a bad response of 0 from C1 occurredcoincidental with a bad response of 1 from C2, the result would also bean output to the tester of a 1. This is called aliasing and it is knownto those skilled in the art of testing, especially testing usingsignature analysis methods. The likelihood of aliasing is rare, but itcan happen.

FIG. 14 shows a scan testable circuit with 3 inputs and 2 outputs.Outputs D and E are fed back to scan cells A and B, respectively. Scancells A and B provide stimulus to the circuit's combinational logic andcapture response from the combinational logic. Scan cell C only providesstimulus to the circuit's combinational logic. It is advantageous forscan cell C to retain the data shifted into it during captureoperations. If the data is retained, it can be output to the tester orreused as stimulus data in downstream circuits. It is common forconventional scan cells to capture data from the circuit's input intoscan cell C of FIG. 14, which may be unknown data. A preferred scan cellcalled a data retaining cell (DRC) is shown in FIG. 14 and shownschematically in FIG. 15. The data retaining cell simply captures thepresent data state of the FF during capture operations, which allows thedata to be supplied to the tester or reused as stimulus data indownstream circuits.

Example 6 simply shows a circuit C1 like FIG. 3 and a circuit C2 likeFIG. 14 having a data retaining scan cell C as shown in FIG. 15. Thecircuits are tested using the warping scan test concept as previouslydescribed. What is important to see in Example 6 is that the C1 responsedata shifted into scan cell C of C2 is retained during the captureoperation to be shifted out to the tester. By retaining the data in scancell C, the tester has the ability to better diagnose failures. Forexample if a failing response was output from C2, that failure may becaused by either; (1) bad combinational logic of C2, (2) incorrectstimulus input from C1 to scan cell C of C2, or (3) both a badcombinational logic in C2 and a bad input stimulus from C1 to scan cellC of C2. If the data in scan cell C is retained, then the tester candiagnose this situation to determine what was bad.

Example 7 shows the ideal case for the warping scan test concept. InExample 7, N circuits as shown in FIG. 3 are connected in series on ascan path operated from a tester as shown in FIG. 5. Every leadingcircuit in this ideal case produces response output that meets thestimulus input need of a trailing circuit. In this example, all circuitsare identical as seen in the present state and next state table.However, they need not be identical, but rather, for the ideal case,they need to meet the statement above, which restated says that “aleading circuit must produce output response that meets the stimulusneed of a trailing circuit”. A leading circuit may produce more outputresponse than is needed for stimulus in a trailing circuit and stillmeet the above criterion, but it cannot produce less. Also, leading andtrailing circuits may have scan path length differences and still meetthe above statement.

In Example 7 it is seen that by the time the first C1 is tested, alltrailing C1s have been tested. The last shift operation (SH8) is used tounload all C1 scan path response residue to the tester. This is aremarkable reduction in test time, especially for IC and systemmanufacturers, since N circuits could be tested in the time it take totest one circuit, plus the time it takes to shift out the responseresidue from the N circuits. The N circuits could be die, wafers, ICs,boards, etc. Examples of different ways the warping scan test conceptcould be employed to reduce test time is described later in regard toFIG. 22-29.

While Example 7 shows the circuits as having 3-bit scan path length anda stimulus pattern requirement of eight, the circuits could have anyscan path length or any stimulus pattern count. If the circuits areidentical, and their scan path lengths are L, their stimulus patterncount is P, and the capture step is C, an equation for the number oftest clocks required to test N identical circuits using the warping scanconcept is P(C+L)+NL−L, where P(C+L) is the test clocks required to testthe first circuit (and the other N−1 circuits), and NL−L is the testclocks required to unload the scan paths of the remaining N−1 circuits.In comparison, an equation for the number of test clocks required totest N identical circuits using the conventional scan approach isP(C+NL). For large L and P, the equations simplify to: Warping Scan TestClocks=L(P+(N−1)) and Conventional Scan Test Clocks=LPN.

Case 1: For L=2000, P=1000, N=1

Warping Scan Test Clocks=L(P+(N−1))=2000(1000+(1−1))=2,000,000

Conventional Scan Test Clocks=LPN=2000×1000×1=2,000,000

Case 2: For L=2000, P=1000, N=100

Warping Scan Test Clocks=L(P+(N−1))=2000(1000+(100−1))=2,198,000

Conventional Scan Test Clocks=LPN=2000×1000×100=200,000,000

Case 3: For L=2000, P=1000, N=1000

Warping Scan Test Clocks=L(P+(N−1))=2000(1000+(1000−1))=3,998,000

Conventional Scan Test Clocks=LPN=2000×1000×1000=2,000,000,000

For a test clock frequency of 10 megahertz (period=100 nanoseconds),Case 1 warping scan test time and conventional scan test is 200milliseconds. Case 2 warping scan test time is 219.8 milliseconds, andconventional scan test time is 20 seconds. Case 3 warping scan test timeis 399.8 milliseconds, and conventional scan test time is 200 seconds.

For non-ideal circuits 1-N where the response output from a testedleading circuit only reduces the stimulus need of all trailing circuitsby a % reduction factor (R), the test clocks required by the warpingscan test concept can be approximated by;

Test Clocks=P ₁(C+L ₁)+RP ₂(C+L ₂)+RP ₃(C+L ₃) . . . RP _(N)(C+L _(N))

For large P_(1-N) and L_(1-N), the equation simplifies to;

Test Clocks=P ₁ L ₁ +RP ₂ L ₂ +RP ₃ L ₃ . . . RP _(N) L _(N)

If the % reduction factor (R) is constant for each circuit, for exampleat the end of each leading circuit test, the need for additionalstimulus in all trailing circuits is reduced by an R of 50%, then;

Test clocks=P _(1-N)+½(P ₂ L ₂)+¼(P ₃ L ₃))−+⅛(P ₃ L ₃)) . . . ½^(N)(P_(N) L _(N))

If all circuits have the same P and L, then;

Test Clocks=P _(1-N) L _(1-N)(1+½+¼+⅛+ . . . ½_(N-1))

Case 4: For L=2000, P=1000, N=2

Warping Scan Test Clocks=PL(1+½)=3,000,000

Conventional Scan Test Clocks=PL(2)=4,000,000

Case 5: For L=2000, P=1000, N=5

Warping Scan Test Clocks=PL(1+½+¼+⅛+{fraction( 1/16)})=3,875,000

Conventional Scan Test Clocks=LP(5)=2000×1000×5=10,000,−000

Case 6: For L=2000, P=1000, N=100

Warping Scan Test Clocks=PL(1+½+¼+⅛+ . . . ½¹⁰⁰)=<4,000,000

Conventional Scan Test Clocks=LP(5)=2000×1000×100=200,0−00,000

Case 7: For L=2000, P=1000, N=1000

Warping Scan Test Clocks=PL(1+½+¼+⅛+ . . . ½¹⁰⁰⁰⁻)=<4,000,000

Conventional Scan Test Clocks=LP(5)=2000×1000×1000=2,00−0,000,000

In comparing Case 2 with Case 6 (N=100) and Case 3 with Case 7 (N=1000),it is seen that there is little difference in the number of test clocksbetween the ideal and non-ideal warping scan test cases, as long as the% reduction factor R is maintained at 50% in the non-ideal cases.

FIGS. 16 through 18 illustrate an example of how the warping scan testconcept could be implemented on circuits that have scannable boundarycells (BC) at the primary inputs and outputs (boundary) of the circuits.Boundary scan cells are well known in the art of testing. FIG. 16relates to the previously described FIG. 3. FIG. 17 relates to thepreviously described FIG. 12. FIG. 18 relates to the previouslydescribed FIG. 14.

Using the warping scan test concept with boundary cells requiresdifferent boundary cell designs than the conventional boundary celldesigns used today. The data capture boundary cells (DCBC) of FIGS. 16,17, and 18 relate to the previously described data capture cell of FIGS.3 and 4A. The data summing boundary cell (DSBC) of FIG. 17 relates tothe previously described data summing cell DSC of FIGS. 12 and 13. Thedata retaining boundary cell (DRBC) of FIG. 18 relates to the previouslydescribed data retaining cell DRC of FIGS. 14 and 15.

Example designs for DCBC and DRBC are respectively shown in FIGS. 19 and20. An example design for DSBC is shown in FIG. 21. FIG. 21A shows howDCBC, DRBC and DSBC are realized. Nodes 191, 193, 195, 197 and 199 areconnected as shown. The BC structure enclosed in broken line isconventional, but the illustrated node connections to realize DCBC, DRBCand DSBC represent part of the present Disclosure.

FIG. 22 illustrates how the warping scan test concept could be used totest multiple circuits C1-CN inside an IC or Die. Each circuit 1-N inFIG. 22 could be similar to circuits previously described in regard toFIGS. 3, 12, 14, and 16-18. Also shown in FIG. 22 is the fact that thecircuits may receive control during the warping scan test from aconventional IEEE 1149.1 standard Test Access Port (TAP) which isconnected externally of the IC/Die to a tester. Alternately, the IC/Diecould receive control directly from the tester, or via a test portdifferent from the IEEE 1149.1 TAP.

FIG. 23 illustrates how the warping scan test concept could be used totest multiple ICs 1-N on a board, or similarly, multiple Die 1-N on amulti-chip module (MCM) substrate. Each IC/Die 1-N in FIG. 23 could besimilar to the IC/Die described previously in regard to FIG. 22. EachIC/Die of the board/MCM is shown interfaced to an external testerconnected to the board/MCM.

FIG. 24 illustrates how the warping scan test concept could be used totest multiple boards (BD) in a box. Each board 1-N in FIG. 24 could besimilar to the board described previously in regard to FIG. 23. Eachboard of the box is shown interfaced to an external tester connected tothe box/board.

FIG. 25 illustrates how the warping scan test concept could be used totest multiple boxes (BX) 1-N in a system. Each box 1-N in FIG. 25 couldbe similar to the box described previously in regard to FIG. 24. Eachbox of the system is shown interfaced to an external tester connected tothe system.

FIG. 26 illustrates how the warping scan test concept could be used totest die on a wafer. Each die could be similar to the die describedpreviously in regard to FIG. 22. As seen in FIG. 27, each die on thewafer has an IEEE 1149.1 test data input (TDI), test data output (TDO),test clock (TCK), test mode select (TMS), and a test reset (TRST) padconnection. Also as shown in FIG. 26, all die are connected in series,via their TDI and TDO pads, between the wafer's TDI input and TDOoutput. Further, all die TMS, TCK, and TRST pads are connected inparallel to the wafer's TMS, TCK, and TRST inputs. By applying power tothe wafer and executing the warping scan tests on all die by probing thewafer's TDI, TDO, TCK, TMS, and TRST wafer test points with a tester,extremely fast testing of all die on the wafer can be achieved. Also,since the warping scan test bypasses tested circuits and holds theirscan paths static, very little heat is generated on the wafer duringwarp testing. For example, at the beginning of a warp scan test, thescan path of all die are active and start to generate heat. When thefirst die is tested it freezes its scan path and begins to cool.Similarly other circuits will freeze their scan paths and begin to coolafter they have been tested. Also the speed of the warp scan test willprevent the circuits from being active for a long enough time togenerate damaging heat.

FIG. 28 illustrates how the warping scan test concept could be used totest multiple wafers in a lot. Each wafer 1-N in FIG. 28 could besimilar to the wafer described previously in regard to FIGS. 26 and 27.Each wafer in the lot is shown interfaced to an external tester.

FIG. 29 illustrates how the warping scan test concept could be used totest multiple lots 1-N. Each lot 1-N in FIG. 29 could be similar to thelot described previously in regard to FIG. 28. Each lot is showninterfaced to an external tester.

FIG. 30 illustrates one way to eliminate the possibility of aliasing aspreviously mentioned in regard to the data summing cell of FIGS. 12 and13 by using conventional signature analyzers (SARs) at the serial inputand serial output of a circuit's scan path. As mentioned earlier,aliasing can occur using the present Disclosure if a first faultyresponse bit is shifted into a data summing cell and a second faultyresponse bit is summed with the first faulty bit during a captureoperation. XOR gates, which are used broadly in testing using signatureanalysis, have the distinction of outputting a 1 if the inputs are 10 or01, or outputting a 0 if the inputs are 11 or 00, which is the root ofthe aliasing problem. Placing an input signature analyzer on the serialinput to the first cell of the circuit's scan path and placing an outputsignature analyzer on the serial output from the last cell of thecircuit's scan path can detect for aliasing during use of DSC and DSBC.

In FIG. 30, it is seen that the input and output signature analyzerscollect signature during each shift clock. If during the warping scantest, a faulty bit is shifted into the circuit, the input signature willbe different from the expected signature. If during the warping scantest, a faulty bit is shifted out of the circuit, the output signaturewill be different from the expected signature. By shifting out the inputand output signatures from each circuit at the end of the warping scantest, the tester can compare each circuit's input and output signaturesto see if aliasing has occurred on the response data it has receivedfrom the circuits. If the tester finds that the response data is correctand the signatures are correct, the test is valid. If the tester findsthat the response data is correct but the signatures are incorrect, thetest is invalid.

The signatures also serve a very useful purpose in aiding the tester inidentifying which circuit first introduced a fault. For example, if 100circuits are tested and a fault is output from the 50th circuit, thetester can identify that the output signature of the 50th circuit failedand go directly to the circuit as the one which caused the other 50circuits to fail. Upon repairing the 50th circuit, the test is repeatedto see if any of the trailing 50 circuits fail, since their tests wereinvalidated in the previous test by the failure of the 50th circuit.

The warping scan test concept becomes more and more effective inreducing test times as more circuits are added in series on the scanpath. The opposite is true with conventional scan testing, i.e.conventional scan testing becomes less and less effective as morecircuits are added in series. The examples in FIGS. 23-29 of usingwarping scan to test boards, boxes, systems, wafers, lots, and lotgroups indicate how a company who produces these types of electricalproducts might exploit the benefit of this Disclosure broadly andstandardize its use at every manufacturing level. Also an advantage ofthe Disclosure is that one simple tester could be used at everymanufacturing level within a company, from die testing to missiletesting.

Although this disclosure has treated circuits as all being on the samescan path, if parallel scan paths were used to test circuits using thewarping scan test concept, additional reductions in test time will beseen.

In FIGS. 26-29, scan testing has been described as a way to test theinternal circuitry of die on wafers. However, a complete wafer testneeds to test the die input and output buffer circuitry as well.Conventional wafer testing uses mechanical probes that contact die padsto allow a tester to input and output test patterns. Since conventionalwafer testing inputs and outputs test patterns via the functional pads,the input and output buffers are tested while the internal circuitry isbeing tested. However, in using scan to test die, the test patterns areinput to and output from the internal circuitry via the TDI and TDO testpads. Therefore, when using scan to test die on wafer, the functionalpads and associated input/output buffers are not tested. A method isneeded to allow input/output buffers to be tested, both parametricallyand functionally, without having to contact the pads using probes.

The present Disclosure provides for such buffer testing, as well astesting of electrostatic discharge protection circuitry and pad busholders, without contacting the pads.

Example FIG. 31 illustrates a wafer similar to that in FIG. 26 butincluding bussing 310, 311 and test pads at 315 for new test signalsTSA, TSB, and TSC. Example FIG. 32 illustrates a die similar to that inFIG. 27 but including die pads at 312 connected to the TSA, TSB, and TSCwafer bussing conductors 311. In the arrangement shown in FIGS. 31 and32, all die pads 312 are accessible from the common TSA-C wafer testpads at 315 via the wafer bussing conductors 311. Other accessarrangements could be used.

For example, each row of die could have its own group of TMS, TCK, TDI,TDO, TRST, TSA, TSB, and TSC test pad signals, as well as power andground, as indicated by the exemplary dotted boxed areas at 313.Partitioning the wafer's die into separate groups (rows in this case)allows simultaneous and parallel scan and buffer testing of each die inthe groups, which can reduce overall test time.

Example FIG. 33 shows a conventional IEEE STD 1149.1 scan cell havingcapture shift (CS) and update (U) memories. The output of the updatememory is conventionally used to control a two terminal switch 330, suchas a transmission gate, to make a connection between its terminals (1 &2) or break a connection between its terminals.

Example FIG. 34 shows an arrangement 341 including a 2-state digitaloutput buffer 340, an electrostatic discharge (ESD) protection circuit,a conventional boundary scan circuit, and four of the scannable switches(S) of FIG. 33 connected in a scan path. A first switch is connectedbetween the boundary scan circuit and the input to the output buffer, asecond switch is connected between the input to the output buffer and aTSA node, and third and fourth switches are connected between the outputof the output buffer and TSB and TSC nodes, respectively. In operation,the buffer receives a data signal from the core circuitry, via theboundary scan circuit, and outputs an amplified version of the datasignal to the die pad. The buffer is connected to a high level voltagerail (Vh) and a low level voltage rail (Vl) which define the outputvoltage switching range of the buffer. An unloaded output buffer mayoutput the full Vh and Vl levels. However, a loaded output buffer willoutput levels less than Vh and more than Vl due to the output buffer'sinternal high and low drive transistor resistances. The ESD circuit ispositioned between the output buffer and the two parallel switches.

The output buffer can be tested conventionally by outputting test datafrom the boundary scan circuit to the input of the output buffer, thencapturing the data output from the output of the buffer back into theboundary scan circuit. While boundary scan can test the logicaloperation of the buffer, it cannot test other electrical propertiesassociated with the output buffer such as; (1) the buffer high and lowdrive strengths, (2) voltage level translation that might occur in thebuffer (i.e. 5 v to 3 v or 3 v to 5 v), (3) propagation delays throughthe buffer, and (4) the ESD circuit.

Example FIG. 35 is similar to FIG. 34 and shows an arrangement 351including a 3-state output buffer 350 having an off condition where itsoutput is disabled from driving the pad, and having a conventional busholder (BH) circuit to hold the pad at the last driven logic state priorto the buffer being disabled. An enable (Ena) control signal passes fromthe core through the boundary scan circuit to enable or disable thebuffer's output. Testing of the buffer is similar to that described inFIG. 34 and is accomplished by the boundary scan circuitry enabling thebuffer and outputting test data to the buffer input and capturing theresults at the buffer output. While boundary scan can test the logicalcorrectness of an enabled buffer to pass ones and zeros, boundary scanis not capable of testing that the output of the buffer is actually in adisabled state, especially if the bus holder is implemented. Theswitches and TSA-C connections shown in FIG. 35 provide for the tests(1)-(4) listed above relative to FIG. 34, plus they additionallyprovide; (5) a test that detects whether the buffer's output is actuallydisabled, and (6) a test that tests the operation of the bus holder.

Example FIG. 36 is similar to FIGS. 34 and 35, but relates to an inputbuffer. The arrangement 361 includes a switch S connected between theTSA node and the output of input buffer 360, and two switches connectedbetween the input of the input buffer and the TSB and TSC nodes,respectively. The switches on the input of the input buffer areconnected between the ESD circuit and the pad. The switches provide thefollowing tests of the input buffer; (1) test logical operation of inputbuffer, (2) test buffer input ranges, (3) test buffer hysteresis if soequipped, (4) test input voltage translation (i.e. 3 v to 5 v or 5 v to3 v), (5) test operation of bus holder, and (6) test ESD circuit.

Example FIG. 37 relates to a bidirectional (e.g. I/O) pad having bothinput and output buffers. The arrangement 371 includes a first switchconnected between the output of the input buffer 360 and the TSA node, asecond switch connected between the input of the output buffer 350 andthe TSA node, a third switch connected between the output of theboundary scan circuit and the input to the output buffer, and fourth andfifth switches connected between the pad wire 370 and the TSB and TSCnodes, respectively. The fourth and fifth switches are connected betweenthe ESD circuit and the pad. The functional operation of thebidirectional buffer can be tested using boundary scan by; (1) enablingthe output buffer, (2) outputting test signals to the input of theoutput buffer, and (3) reading the test signals back from the output ofthe input buffer. The switches S provide all the tests previouslymentioned in regard to the output buffers of FIGS. 34 and 35, and inputbuffer of FIG. 36. The switches connected to the pad wire are shared fortesting both the input and output buffers.

In normal functional mode, the TSA-C switches shown in FIG. 34-37 areopen and the switch between the boundary scan circuit and output bufferswill be closed. When an output buffer is being tested, the TSA-Cswitches will be closed and the switch on the input of the output bufferwill be opened. Likewise, when an input buffer is being tested, theTSA-C switches will be closed. Using switches like that shown in FIG. 33allows individual selection of whether a switch is closed or opened. Forexample, it is possible to close any one or more of the TSA-C switchesduring normal functional mode, in order to monitor a functioning inputor output signal(s). In another example, it is possible to open theswitch between the boundary scan circuit and output buffer and closeswitch TSA to allow injecting a signal to be output from the outputbuffer during normal operation of the die.

If such switch control flexibility is not required, a single captureshift update scan cell, as shown in FIG. 33, could have its updateoutput coupled to all switches 330 in any of FIGS. 34-36 to control theswitches as a group to their closed or open state. If a single captureshift update scan cell were used on the input buffer of FIG. 36, itsupdate output would be used to (1) open all TSA-C switches and (2) closeall TSA-C switches. If a single capture shift update scan cell were usedon the output buffers of FIGS. 34 and 35, its update output would beused to (1) open all TSA-C switches and close the switch between theboundary scan circuit and buffer and (2) close all TSA-C switches andopen the switch between the boundary scan circuit and buffer. In thebidirectional buffer of FIG. 37, a first capture shift update scan cellcould be used to close or open the TSA switch 372 and the TSB and TSCswitches, while a second capture shift update scan cell could be used toopen or close the switch between the boundary scan circuit and outputbuffer, and appropriately close or open the TSA switch 373 and the TSBand TSC switches. The update outputs of the first and second captureshift update cells would be logically Ored to produce the control signalthat opens/closes the TSB and TSC switches.

Example FIG. 38 shows how all the TSA nodes of FIGS. 34-37 can be bussedtogether on a die and connected through a FIG. 33 switch to a TSA pad onthe die at 312. Likewise, all TSB and TSC nodes of FIGS. 34-37 can bebussed together on a die and connected through respective switches toTSB and TSC pads on the die at 312. The dotted lines indicate additionalbuffers connected to the TSA, TSB, and TSC bussing paths. A serial scanpath 391 is routed through each buffer's switches, the TSA-C padswitches, and the boundary scan circuit to provide control to close oropen the switches of each buffer during test. For example, a first scanoperation can be performed to close the input buffer's switches (top)and the TSA-C pad switches to allow a tester, connected to the TSA-Cpads, to access and test the input buffer via its associated TSA-Cnodes. After the input buffer is tested, a second scan operation isperformed to open the input buffer switches, maintain the TSA-C padswitches closed, and configure the output buffer switches (next to top)to allow tester access and testing of the output buffer. Similarly,subsequent scan operations can be used to access and test the remainingbuffers on the die. In the case of the 3-state and bidirectionalbuffers, the boundary scan circuit will be controlled by scan to outputthe required enable control to the buffers to allow testing the buffersin their enabled and disabled states.

A proposed IEEE standard 1149.4 requires the TSB and TSC switches ofFIGS. 34-37, as well as the TSB and TSC pads, pad switches and bussingpaths of FIG. 38. These parts of the 1149.4 architecture can thus bereused to implement the present Disclosure. If the IEEE standard 1149.4architecture is reused for the present Disclosure, the test circuitoverhead is reduced to only the two switches (one being for TSA)connected to the input of an output buffer, the switch (for TSA)connected to the output of an input buffer, and the TSA pad, pad switchand bussing paths.

FIG. 39A shows an example of how probeless testing of a 3-state outputbuffer occurs using the present Disclosure. While this example uses a3-state output buffer, it will be clear that 2-state output buffers aretested similarly, except 2-state output buffers do not require an outputdisable (i.e. high impedance) test. Test access to the die is providedby a tester that contacts the die via the die's TSA-C pads and IEEE STD1149.1 scan interface pads (TCK, TMS, TDI, TDO). For clarity, thetester's serial interface only shows the scan test data input (TDI) andscan test data output (TDO) terminals. Although only a singlearrangement 351 and its associated boundary scan circuitry are shown,the internal scan path 391 of the die should be understood to passthrough other arrangements 351, 341, 361 and 371 and their associatedboundary scan circuits inside the die (see FIG. 38). Also, the externalscan path 393 may traverse other die connected therein between thetester and the illustrated die.

In the example of FIG. 39A, the tester includes a conventional scaninterface for controlling scan operations, signal generators forproducing DC and AC test signals, voltmeters for measuring DC and ACvoltages, a first switching circuit (SW1) for connecting the tester'sTSA or TSB terminals to the voltmeter or signal generators, a secondswitch circuit (SW2) for connecting the tester's TSC terminal, through aknown resistor R, to a programmable voltage source (Vp), and aconventional test control computer for controlling the overall operationof the tester.

As previously mentioned, using boundary scan the output buffer can betested for correct logical operation. However, since the buffer outputis not loaded, as it would be if the die were tested using conventionalprobe testing, the boundary scan test does not test the strength of thebuffer's high and low drive transistors. In FIG. 39A, the TSC buffer andpad switches 392 and 394 should be designed with a relatively low “on”resistance, since the Disclosure uses the TSC path to provide a load foroutput buffers. The remaining switches in the TSA and TSB paths can havehigher “on” resistance since the Disclosure uses these paths to inputsignals to and/or monitor signals from buffers.

To test the output buffer drive strengths using the present Disclosure,and referencing FIG. 39A, a scan operation is performed to; (1) enablethe output buffer via the boundary scan circuit's Ena signal, (2) openthe switch between the boundary scan circuit and the output buffer, and(3) close all of the TSA-C buffer and pad switches. Following this scanoperation, the tester makes a connection through SW1 to allow inputtinga signal from a signal generator to the input of the output buffer, viathe TSA buffer and pad switches. The tester also makes a connectionthrough SW1 to allow a voltmeter to monitor the buffer output via theTSB buffer and pad switches. The tester inputs a signal from the signalgenerator, via the TSA path, to cause a high output from the buffer andmeasures this value using a voltmeter via the TSB path. Since the bufferoutput is not loaded (SW2 is open), the measured value, Vmh, should beequal to the high level rail voltage (Vh) of the buffer (if CMOS) or aknown voltage slightly below the high level rail voltage (e.g. Bipolar).Next the tester inputs a signal via the TSA path to cause a low outputfrom the buffer and measures this value using a voltmeter via the TSBpath. Again since the buffer output is not loaded (SW2 is open), themeasured value, Vml, should be equal to (CMOS) or slightly above(Bipolar) the low level rail voltage (Vl) of the buffer.

Note that the TSC switches could be left open during the unloaded testdescribed above if closing them causes the buffer output to experiencean undesired capacitive load. An advantage of closing them along withthe TSA and TSB switches is that it eliminates having to perform anotherscan operation in preparation for the loaded test described below.

Next, the tester inputs a signal from the signal generator via the TSApath to cause the buffer to output a high level voltage. The testerprograms a voltage on Vp that is lower than the buffer's unloaded highlevel output voltage and makes a connection between the buffer's outputand Vp, via the two TSC switches, the known resistor (R), and SW2.Programming Vp to be a lower voltage than the buffer high output voltagecauses current to flow from the buffer through resistor R via the TSCsignal path. This TSC path connection is used to provide a load on thebuffer output to Vp. If, for example, SW2 is a relay with a closedresistance of 0.1 ohm, the known resistance R is 10 ohms, the “on”resistance of the TSC pad switch is 50 ohms, and the “on” resistance ofthe TSC buffer switch is 100 ohms, the TSC path provides a load of lessthan 200 ohms to test the buffer's high output drive level.

Next, the tester uses a voltmeter to measure the voltage (Vr) across theknown resistor R to determine the output current Io flowing from thebuffer through resistor R via the TSC path. Next, the tester uses avoltmeter to measure the voltage at the output of the buffer (Vo) viathe TSB path. As is conventional, the voltmeters have high inputimpedance to prevent them from affecting the voltage measurements taken,i.e. no significant current flows into or from the voltmeters. Byknowing the buffer's unloaded high voltage value Vmh as previouslymeasured, the high drive resistance (Rh) of the output buffer can bedetermined by dividing the voltage difference between Vmh and Vo by thedetermined output current Io, i.e. Rh=(Vmh−Vo)/Io.

To measure the low drive resistance of the output buffer, the testercontrols the signal generator to input a signal on the TSA path to causethe buffer to output a low level voltage. The tester programs a voltageon Vp that is higher than the buffer's unloaded low level output voltageand makes a connection between the buffer's output and Vp, via the twoTSC switches, the known resistor (R), and SW2. Programming Vp to be ahigher voltage than the buffer low output voltage causes current to flowfrom Vp to the buffer via the TSC signal path. Next, the tester measuresthe voltage (Vr) across the known resistor R to determine the inputcurrent Ii to the buffer. Next the tester measures the voltage output(Vo) of the buffer via the TSB path. By knowing the buffer's unloadedlow voltage value Vml from a previous measurement, the low driveresistance (Rl) of the output buffer can be determined by dividing thevoltage difference between Vo and Vml by the determined input currentIi, i.e. Rl=(Vo−Vml)/Ii.

Some output buffers may permit programmability of their high and/or lowoutput drive strengths. This capability is shown by the dotted linedrive strength control (DSC) input to the output buffer. In FIG. 39A,the DSC is shown coming from a register or memory within the IC core viathe boundary scan register. Alternately, the drive strength controlcould come solely from the boundary scan register. Stored drive strengthcontrol data determines the high and/or low drive strength of the outputbuffer. The present Disclosure can be used to test the various drivestrength settings of output buffers having this feature by outputting adrive strength setting to the buffer from the boundary scan register andrepeating the above described high and low drive strength tests (Io andIi tests) for each possible drive strength setting.

The present Disclosure can also be used to test buffers that translatevoltage levels received at their input into different voltage levelsdriven from their output. For example, the output buffer of FIG. 39A mayreceive from the core a signal that switches between 0 and 3 volts andoutput to the pad a corresponding signal that switches between 0 and 5volts.

To test an unloaded output buffer's capability to translate an inputsignal of a first given voltage swing into an output signal of a secondgiven voltage swing, the following steps occur. A scan operation isperformed to: (1) enable the buffer, (2) open the switch between thebuffer and boundary scan circuit, and (3) close the switches in theTSA-C paths between the buffer and tester. Next, with SW2 open, thetester is setup to input a signal of a first given voltage swing to theinput of the buffer, via a signal generator and the TSA path, andmeasure the output response of the buffer, via the TSB path, using avoltmeter to determine if the buffer outputs the expected voltage swing.

To test a loaded output buffer's capability to translate an input signalof a first given voltage swing into an output of a second given voltageswing, the same test as described above is performed except SW2 isclosed to make a connection to Vp to provide a load on the buffer outputvia the TSC path. When the buffer output is set high, Vp is programmedto be at a lower voltage to emulate a load that sinks current from thebuffer. When the buffer output is set low, Vp is programmed to be at ahigher voltage to emulate a load that sources current into the buffer.During each loaded buffer output state, a voltmeter is used to measurethe buffer's output voltage via the TSB path.

The propagation delay of the output buffer of FIG. 39A can be tested byenabling the buffer (if a 3-state type) and opening the switch betweenthe buffer and boundary scan circuit, followed by inputting test signalsto the buffer input via the TSA path (switches closed) and receivingtest signals from the buffer output via the TSB path (switches closed).The TSC path can provide a load (SW2 closed) or not provide a load (SW2open) on the buffer output signal during test. While this is not anexact propagation delay test, due to the loading effect the TSA and TSCpaths have on the signals, it does give an indication of the propagationdelay through the buffer. The computer is capable of the conventionalfunction of measuring the time delay between when a test signal istransmitted from a signal generator and received at a voltmeter.

In FIG. 39B, one conventional form of the ESD circuit of FIG. 39A isshown consisting of two diodes both connected to the pad wire and eachindividually connected to the positive (V+) and negative (V−) voltagesupplies of the die. The diode connected between the pad wire and V+will conduct current from the pad wire to V+ if the voltage on the padwire increases enough to forward bias the diode. Likewise, the diodeconnected between the pad wire and V− will conduct current from V− tothe pad wire if the voltage on the pad wire decreases enough to forwardbias the diode. The diodes serve to clamp the pad wire voltages to beingno more positive than V+ plus the diode forward bias voltage drop and nomore negative than V− minus the diode forward bias voltage drop.

To test the diode between the pad wire and V+, the tester disables the3-state buffer's output and closes the TSB and TSC paths. Next thetester inputs an increasing voltage level to the buffer output via theTSC path and Vp and monitors the buffer output voltage via TSB. Thevoltage on TSB will be equal to the voltage on TSC as long as the diodeis not forward biased. When the voltage output on TSC exceeds V+ by anamount sufficient to forward bias the diode, the voltage input on TSBwill be clamped to V+ plus the forward bias voltage drop across thediode. Increasing the voltage at Vp will result in a greater voltagedrop across the switches in the TSC path and across R because of theincrease in current flow through the diode to V+. However, if the diodeis good, the voltage at the output of the buffer will remain clamped atV+ plus the diode voltage drop. If the diode is faulty, the voltage onthe buffer output will increase with the voltage at Vp.

To test the diode between the pad wire and V−, the tester disables the3-state buffer's output and closes the TSB and TSC paths. Next thetester inputs a decreasing voltage level to the buffer output via theTSC path and Vp and monitors the buffer output voltage via TSB. Thevoltage on TSB will be equal to the voltage on TSC as long as the diodeis not forward biased. When the voltage output on TSC is less than V− byan amount sufficient to forward bias the diode, the voltage input on TSBwill be clamped to V− minus the forward bias voltage drop across thediode. Decreasing the voltage at Vp will result in a greater voltagedrop across the switches in the TSC path and across R because of theincrease in current flow through the diode from V−. However, if thediode is good, the voltage at the output of the buffer will remainclamped at V− minus the diode voltage drop. If the diode is faulty, thevoltage on the buffer output will decrease with the voltage at Vp.

If the buffer in FIG. 39A were a 2-state buffer, the TSA path would beclosed to input a signal causing the buffer output to go high. Thevoltage input on TSC is then increased starting from the buffers highlevel output voltage to a level that should forward bias the diodebetween the pad wire and V+ to test the top diode. Next, a signal on TSAis input to cause the buffer output to go low. The voltage input on TSCis then decreased starting from the buffer's low level output voltage toa level that should forward bias the diode between the pad wire and V−to test the bottom diode.

In prior art FIG. 39C, another conventional output ESD protectioncircuit is shown. This ESD circuit has a series resistor between the padand output buffer and an SCR having a first node connected between theseries resistor and pad and a second node connected to ground. Inresponse to a higher than normal voltage input to the pad, the buffer'soutput will breakdown and conduct current. The series resistor protectsthe output buffer during breakdown by limiting the current flow from thepad to the output buffer. The current flow from the pad to the outputbuffer will cause a voltage to be developed across the series resistor.The sum of the voltage at the output of the buffer and the voltagedeveloped across the series resistor provides a sufficient triggervoltage to turn the SCR on to allow current from the pad to be safelyshunted to ground via the SCR.

To test the operation of the FIG. 39C ESD circuit conventionally, atester would probe the pad and inject a voltage that would trigger theSCR. To test the FIG. 39C ESD circuit using the present Disclosure (i.e.without probing), and assuming the ESD circuit of FIG. 39C is positionedas shown in FIG. 39A, the tester inputs an increasing voltage to the padvia the TSC path and monitors the pad voltage via the TSB path. When thevoltage input to the pad reaches a level that causes the output bufferto breakdown and conduct current, the sum of the output buffer andseries resistor voltages provides the trigger level required to turn theSCR on. The tester can detect when the SCR turns on by monitoring thepad voltage on the TSB path and/or by monitoring for an increasedvoltage drop across R as a result of the increased current flow throughthe SCR via the TSC path.

In FIG. 39C, a diode is conventionally used to protect the output bufferagainst a lower than expected voltage at the pad (as described above inregard to FIG. 39B), and can be tested as previously described using thepresent Disclosure.

To test that the output buffer can be disabled, the tester performs ascan operation to disable the buffer by the Ena signal from the boundaryscan circuit and closes the switches in the TSB and TSC paths. Next thetester inputs a varying voltage from Vp to the pad wire via the TSC pathand monitors for the same voltage to be returned to the tester via theTSB path, the voltmeter being conventionally capable of measuringtime-varying voltages. If the buffer is disabled, the pad wire voltagewill follow the varying Vp voltage. If the buffer is not disabled, thepad wire voltage will not follow Vp. Also the tester can detect anon-disabled buffer by sensing a voltage drop across R due to currentflow on TSC in response to a fixed voltage output from the buffer and avarying voltage output on Vp.

To test the bus holder, the tester performs a scan operation to disablethe buffer by the Ena signal from the boundary scan circuit and closesthe switches in the TSB and TSC paths. Next the tester inputs a logichigh level voltage from Vp to the pad wire via the TSC path to set thebus holder high. The TSB path can be used to read the high from the padwire. Next the tester inputs a decreasing voltage level from Vp to thepad wire via the TSC path. While Vp is decreasing, the tester monitorsthe voltage drop across R to detect the extremely small current flowfrom the bus holder to Vp as the bus holder, typically a pair ofcross-coupled inverters, attempts to maintain the high logic state.Eventually, the voltage from Vp will reach a point where the bus holderwill trip from attempting to hold a logic high to holding a logic low onthe pad wire. When the bus holder trip point occurs, the small currentit has supplied to Vp in its attempt to maintain the logic high willcease, and the bus holder will begin to sink a small current from Vp.The tester can detect this change of current direction by seeing thatthe polarity of the small voltage drop across R has changed.

Next the tester inputs an increasing voltage level from Vp to the padwire via the TSC path. While Vp is increasing, the tester monitors thevoltage drop across R to detect the extremely small current flow to thebus holder from Vp as the bus holder attempts to maintain the low logicstate. Eventually, the voltage from Vp will reach a point where the busholder will trip from attempting to hold a logic low to holding a logichigh on the pad wire. When the bus holder trip point occurs, the smallcurrent it has sunk from Vp in its attempt to maintain the logic lowwill cease, and the bus holder will begin to source a small current toVp. The tester can detect this change of current direction by seeingthat the polarity of the small voltage drop across R has changed.

If the tester does not see any voltage drop across R as it moves Vp fromone logic level to the next, then the bus holder is defective. It isadvantageous during this bus holder test if R has a relatively highresistance of, for example, 10 M ohms to ease detection of the voltagedrop across R caused by the small current sourced and sunk by the busholder.

Using the arrangement shown in example FIG. 40A, the following tests ofan input buffer can be performed.

To test the logical operation of the input buffer of FIG. 40A, thetester performs a scan operation to close the switches in the TSA andTSB paths. Next the tester inputs a signal from a signal generator tothe input of the input buffer via the TSB path and reads the signaloutput from the input buffer via the TSA path. The tester verifieswhether the input buffer responds correctly to all signal inputs.

Digital input buffers are typically designed with input voltage rangessuch that, if the input voltage remains within a given input range, thebuffer will continue outputting the desired logic state. Differenttechnologies, like CMOS and Bipolar, have different input ranges. Totest the input ranges of the input buffer of FIG. 40A, the testerperforms a scan operation to close the switches in the TSA and TSBpaths. Next the tester inputs a low signal from a signal generator tothe input of the input buffer via the TSB path to set the buffer outputlow, and verifies this low via the TSA path. Next the tester increasesthe input voltage to the buffer to the maximum level within the lowerinput range, and then checks to see if the buffer output remains low byreading the buffer output level via the TSA path. Next the tester inputsa high signal to the input of the buffer via the TSB path to set thebuffer output high, and verifies this high via the TSA path. Next thetester decreases the input voltage to the buffer to the minimum levelwithin the upper input range, and then checks to see if the bufferoutput remains high by reading the buffer output via the TSA path.

Some digital input buffers are designed with input hysteresis that willcause the buffer output to go high only after a first input voltagelevel (threshold) has been received. Once the buffer output goes high,it will not return low until after a second, lower input voltage level(threshold) has been received. Likewise, the input buffer output will golow when the second input voltage level is received and will not returnhigh until after the first input voltage level is received. Hysteresisis used to reduce the possibility of noise on input buffer inputs fromcausing state changes on input buffer outputs.

To test hysteresis on the input buffer of FIG. 40A, the tester performsa scan operation to close the switches in the TSA and TSB paths. Nextthe tester inputs from a signal generator to the input of the inputbuffer via the TSB path a voltage low enough (i.e. below theaforementioned second voltage level) to set the buffer output low, andverifies this low via the TSA path. Next the tester increases the inputto the buffer above the first input voltage level, then lowers it belowthe first input voltage level, but not below the second input voltagelevel, and then returns it to above the first input voltage level.During this operation, the tester verifies, via the TSA path, that thebuffer output changes from low to high in response to receiving inputabove the first input voltage level, and remains high while the input istaken below the first input voltage level and then back above the firstinput voltage level. Next the tester decreases the input to the bufferbelow the second input voltage level and then raises it above the secondinput voltage level, but not above the first input voltage level, thenreturns it to below the second input voltage level. During thisoperation, the tester verifies that the buffer output changes from highto low in response to receiving input below the second input voltagelevel, and remains low while the input is taken above the second inputvoltage level and then back below the second input voltage level.

In FIG. 40A, the input buffer voltage translation is tested aspreviously described in regard to the output buffer of FIG. 39A, withthe exception that the tester uses the TSB path to input signals to thebuffer and the TSA path to receive translated signals from the buffer.

In FIG. 40A, the bus holder for input buffers is tested as previouslydescribed in regard to the output buffer of FIG. 39A.

In FIG. 40A, diode ESD circuitry, as shown in FIG. 39B, is tested aspreviously described in regard to the output buffer description of FIG.39A.

In prior art FIG. 40B, a conventional input ESD protection circuit isshown. This ESD circuit has a series resistor between the pad and inputbuffer, a silicon controlled rectifier (SCR) having a first nodeconnected between the series resistor and pad and a second nodeconnected to ground, and a field plate diode (FPD) having a first nodeconnected between the series resistor and input buffer and a second nodeconnected to ground. In response to a higher than normal voltage inputto the pad, the FPD will conduct current and clamp the voltage input tothe buffer to a level that will not damage the buffer. When the FPDconducts current, the current will flow from the pad through the seriesresistor and FPD to ground. As a result of this current flow, a voltagewill develop across the series resistor. The sum of the FPD clampvoltage at the input of the buffer and the voltage developed across theseries resistor provides a sufficient trigger voltage to turn the SCR onto allow current from the pad to be safely shunted to ground via theSCR.

To test the FIG. 40B ESD circuit as it is shown positioned in FIG. 40A,the tester inputs an increasing voltage to the pad via the TSC path andmonitors the pad voltage via the TSB path. When the voltage input to thepad reaches a level that causes the FPD to conduct, the sum of the FPDand series resistor voltages will trigger the SCR to turn on. The testercan detect this condition by monitoring voltage on the TSB path and/orby monitoring for an increased voltage drop across R as a result of theincreased current flow through the SCR via the TSC path.

In testing the ESD circuit of FIG. 39B, each of the TSB and TSC switchescan be connected to the pad wire at any desired point (on either side ofthe ESD circuit) in FIGS. 39A and 40A. However, when testing the ESDcircuits of FIGS. 39C and 40B, the TSB and TSC switches should both beconnected to the pad wire between the pad and the ESD circuit, as shownin FIGS. 39A and 40A.

Example FIG. 41 illustrates how the present Disclosure can test ananalog output buffer 413 and an analog circuit associated with theanalog output buffer, which analog circuit and buffer are, for clarity,shown on the same die and scan path as the digital core of FIGS. 39A and40A. A difference between FIGS. 39A and 41 is that FIG. 41 has at 410and 411 two additional switches S placed on the input of the analogcircuit and at 412 an additional switch S placed on the output of theanalog circuit. The first input switch 410 is used to make or break aconnection between the analog circuit input and other circuits, and thesecond input switch 411 is used to make or break a connection betweenthe analog circuit input and the tester via the TSA pad. The outputswitch 412 is used to make or break a connection between the analogcircuit output and the tester via the TSB pad.

Testing of the analog output buffer is similar to the testing of thedigital output buffer previously described in FIG. 39A. At the beginningof the analog buffer test, the tester performs a scan operation to openswitches 411, 412 and 414, and close the switches in the TSA, TSB, andTSC paths to connect the buffer to the tester.

Following this scan operation, testing of the analog buffer isaccomplished by inputting analog signals to the buffer via the TSA pathand monitoring the analog signals at the buffer output via the TSB path.Providing a load on the buffer output, to measure its drive strength andhigh and low drive resistance, is accomplished via the TSC path aspreviously described in regard to FIG. 39A. If the buffer were a 3-statetype, the disabled state of the buffer could be tested as previouslydescribed in FIG. 39A.

Testing of the analog circuit is similarly achieved. At the beginning ofthe analog circuit test, the tester performs a scan operation to openthe switches 410, 414, 415 and 417, and to connect the analog circuit tothe tester via the switches 411 and 412. Following this scan operation,testing of the analog circuit is accomplished by the tester inputtinganalog signals to the circuit via the TSA pad and monitoring the analogsignals at the circuit output via the TSB pad. To shorten the test time,the analog buffer test can be combined with the analog circuit test byclosing the switch 414, opening switch 412, and closing switch 417 onthe TSB path to allow the tester to monitor the analog circuit outputvia the analog buffer's output.

Example FIG. 42 is similar to FIG. 41 and illustrates how the presentDisclosure can test an analog input buffer 423 and an analog circuitassociated with the analog input buffer. The circuit and buffer to betested are shown for clarity on the same die and scan path illustratedin FIGS. 39A, 40A and 41.

Testing of the analog input buffer 423 is similar to the testing of thedigital input buffer previously described in FIG. 40A. At the beginningof the analog input buffer test, the tester performs a scan operation toopen switches 411, 412 and 414, and close the switches in the TSA, TSB,and TSC paths to connect the buffer to the tester. Following this scanoperation, testing of the analog buffer is accomplished by inputtinganalog signals to the buffer via the TSB path and monitoring the analogsignals at the buffer output via the TSA path.

Testing of the analog circuit is similarly achieved. At the beginning ofthe analog circuit test, the tester performs a scan operation to openswitches 410 414, 415 and 417, and close switches 411 and 412. Followingthis scan operation, testing of the analog circuit is accomplished bythe tester inputting analog signals to the analog circuit via the TSBpad and monitoring the analog signals at the analog circuit output viathe TSA pad. The analog input buffer test can be combined with theanalog circuit test by closing switch 414, opening switch 412, andclosing switch 417 to allow the tester to stimulate the analog circuitinput via the analog input buffer.

In conjunction with the above-described testing of analog circuits, thevoltmeter preferably includes a conventional digitizer for digitizingreceived analog signals so that the computer can use the digitizedsignals to perform conventional frequency domain analysis relative tothe received analog signals.

While the example output buffers shown herein are high and low drivecapable, it should be evident from the foregoing description that opendrain or open collector buffers can be tested as well using thetechniques of the present Disclosure.

Although exemplary embodiments of the present Disclosure are describedabove, this description does not limit the scope of the Disclosure,which can be practiced in a variety of embodiments.

What is claimed is:
 1. A semiconductor body having an integrated circuitformed at a surface thereof, the integrated circuit comprising: A. corefunctional logic having a data lead; B. a data pad, a first test pad, asecond test pad, and a third test pad; C. a terminal buffer coupled in asignal path between the data lead and the data pad; D. a first testswitch for selectively connecting a first test lead to the signal pathbetween the terminal buffer and the data pad and free of the data pad;E. a second test switch for selectively connecting a second test lead tothe signal path between the terminal buffer and the data pad and free ofthe data pad; F. a third test switch for selectively connecting a thirdtest lead to the signal path between the terminal buffer and the datalead; G. a fourth test switch selectively connecting the first test leadto the first test pad; H. a fifth test switch selectively connecting thesecond test lead to the second test pad; I. a sixth test switchselectively connecting the third test lead to the third test pad; and J.control circuitry for controlling the operation of the first, second,third, fourth, fifth, and sixth test switches so as to be open in normaloperation, and so as to be selectively closed in a test mode.
 2. Thesemiconductor body of claim 1 including an electrostatic dischargeprotection circuit coupled in the signal path between the terminal padand the data buffer.
 3. The semiconductor body of claim 1 including abus holder circuit connected to the signal path between the data pad andthe terminal buffer.